Composite stencils, methods of making, and methods of decorating with composite stencils

ABSTRACT

A composite stencil for applying designs to walls and other surfaces is disclosed. The stencil includes a porous textile support layer to which a flexible stencil mask is bonded by an adhesion layer. The support layer supports unconnected parts of the stencil mask without bridges common with traditional stencils. Further, the textile support layer in the open areas of the stencil can be colored with a sublimation dye to suggest to a user the colors that should be applied in the various areas of the stencil. A pressure sensitive adhesive is applied to the back of the stencil. In use, the stencil is removably adhered to a surface by the pressure sensitive adhesive, whereupon paint or other pigment is applied through the textile support layer to the surface. The lack of bridges permits the entire design to be applied with a single stencil in a single session. The stencil is cleanable and reusable to apply additional designs.

REFERENCE TO RELATED APPLICATION

This patent application is a continuation of co-pending U.S. patentapplication Ser. No. 13/646,749, filed Oct. 8, 2012, which applicationclaims priority to U.S. patent application Ser. No. 12/618,969, filedNov. 16, 2009, which application claims priority to U.S. provisionalpatent application No. 61/168,352 filed on Apr. 10, 2009. Each of theforegoing is incorporated herein in its entirety by this reference.

TECHNICAL FIELD

This disclosure relates generally to stencils and to decorating withstencils and more specifically to composite stencils having a backingthat supports a stencil mask, and to methods of decorating withcomposite stencils.

BACKGROUND

Stencils have long been manufactured by expropriated methods such asdie-cutting, routing, laser-cutting, engraving, exposing by ultravioletlight, developing, and etching. Some of the earliest stencils used byprofessional painters were cut out by knife from paperboard or cardboardsuch as Manila-board impregnated to be oil resistant to a degree, since,at that time, most of the paints used with stencils to illustrate anddecorate walls and furniture were oil based. More recently, stencilswere die cut from vinyl and polypropylene plastic sheets, which resultsin stencils that are resistant to water-based acrylic and latex paints.Because of the limitations of die making, routing, cutting, andplotting, the original artwork embodied in the stencil has had to bemodified and adapted. For example, sharp corners and small diameterholes were not possible. Because of this inconvenience, the industrymore recently has moved to laser-cut stencils, which is an improvementand finer details are achievable. Another group of stencils is stencilsformed of copper, messing, or stainless steel that has been chemicallyetched to form the stencil mask.

The most common drawback of today's stencil technology is the necessityto bridge every non-connected part of the stencil mask to the main bodyof the stencil material to hold these otherwise free-floating parts inplace. This results, however, in a bridged transformation of theoriginal artwork when the stencil is used to apply a design because thebridges mask paint and result in unpainted voids or gaps in what shouldbe painted areas of the design. Typically, this can only be corrected bysequential overlaying use of up to three stencils, with the decoratorlayering the paint, or other color material in steps to obtain theoriginal design. This is not only cumbersome and time consuming, itoften results in a less than pleasing design due to difficulties ofoverlaying subsequent stencils accurately, matching the paint preciselyfrom layer to layer, and similar problems.

Another drawback of prior art stencil manufacturing is that, since thestencil is formed by a cutting knife, die-cutting, laser-cutting,engraving, routing or some other subtractive technique, the inner partsthat are cut away are lost as waste. With stencils created byphotographic and etching techniques, excess material that is dissolvedor etched away is wasted and needs to be disposed of as does theemulsions and other chemicals used in these techniques. When usingelectroplating techniques to fabricate stencils, there are subsequentenvironmental issues arising from the chemicals and metals used in theprocess. A problem with laser cut stencils is that the laser cutting isusually done from polyester sheets that are relatively thin and thushave limited dimensional stability. Metal etching techniques of formingstencils is a slow process with large environmental drawbacks. Further,it results in stencils that lack transparency and flexibility andtherefore that are not particularly useful for artistic decorating withpaints and pigments.

It is more and more common that individuals themselves, often referredto as “do-it-yourselfers,” carry out many home decorating improvementsthat involve the use of stencils to apply designs to a surface. Toovercome problems associated with the bridges of traditional stencils,U.S. Pat. No. 2,651,871 teaches a method of multiple sequential layeringof complementary stencils to reproduce the original art. As mentionedabove, this can be cumbersome and can produce unsatisfactory resultseven for professionals, and these problems are only exacerbated with theless experienced home user. U.S. Pat. No. 3,724,420 teaches, among otherimprovements, the use of thick stencils with high walls and narrowbridges to allow one to apply paint within the stencil beneath thebridges. A disadvantage of such a stencil, however, is the loss offlexibility for use on irregular walls and textiles. U.S. Pat. No.4,268,576 teaches the use of a special porous tissue paper to supportopen or loose parts of the stencil in an attempt to avoid bridges.However the stencil mask material itself in this patent is aphotosensitive or ultraviolet curable film that must be developed and/orwashed out in areas where paint is to be applied. These methods are lesspractical to produce efficiently in large numbers, and the mechanicalstrength and the reusability after reclaiming or cleaning the stencilswith water, soap, or solvents is severely limited.

Accordingly, an improved stencil and method of its fabrication is neededthat addresses the problems and shortcomings of the prior art, some ofwhich are discussed above. A need also exists for a method of decoratingwith such stencils that produces better and more consistent images onmany surfaces without the need to layer stencils sequentially or to tryto match paint layers applied by successive stencils. Finally, a needexists for stencils that are more convenient and instructive for useboth by professionals and non-professional individuals ordo-it-yourselfers applying decorations in their own homes. It is to theprovision of a stencil, stencil fabrication techniques, and stencil usesthat address these and other needs that the present invention isprimarily directed.

SUMMARY

Briefly described, an improved stencil for applying decorative designsto walls and other surfaces is disclosed. The stencil has a textilestencil support sheet or layer that has been compressed and its fibersfused and interlocked with heat to stabilize the support layer. Astencil mask made of flexible impermeable material is applied to thesupport layer and is thermally adhered or fused thereto, preferably witha thermal adhesion layer, which can be applied as a powder. The openareas between areas covered by the stencil mask are areas through whichpaint is to be applied to an underlying surface during use of thestencil. The textile support layer, at least partially because of itsfused and interlocked fibers, is relatively robust and supports open orotherwise unconnected portions of the stencil mask in their properpositions within the stencil design. At the same time, the textilematerial is porous enough to allow paint to be used in the stencilingprocess to pass through to a surface below. A pressure sensitiveadhesive is applied to the back of the stencil within the stencil maskand is protected until use with a protective release layer. Optionally,the textile support layer within the open areas of the stencil mask maybe colored with, for example, dye sublimation inks, to correspond tosuggested colors to be applied at various locations to obtain a pleasingdesign. Information or other instructions for use also may be providedwithin the open areas. Color information and other instructions also maybe printed on the closed part of the stencil if desired.

In use, the protective release layer is removed from the back of thestencil and the stencil is placed against a wall or other surface toreceive a stenciled design. The pressure sensitive adhesive adheres thestencil to the surface. Paint can then be applied in the open areasbetween the stencil mask and the paint passes through the textilesupport layer therein and onto the surface below. If the support layerhas been pre-died to suggest coloration, the user may apply colorscorresponding to those that appear on the textile support layer betweenthe stencil mask. Because there are no bridges holding floating orunconnected portions of the stencil mask in place, paint can be appliedwithin the entire image with a single stencil and a single paintingsession without any artifacts in the final design caused by bridges, ashas been the case in the past. Further, the painter can apply designsthat are more subtle and detailed. After use, the stencil of thisdisclosure can simply be washed out to remove any remaining paint andcan be used over and over to apply multiple copies of the design.

Somewhat more specifically described, an object of this disclosure is anovel and improved method of applying art and decorative designs to awide range of surfaces using stencils that are relatively inexpensive tomanufacture and are reclaimable, easy to clean, reusable, do not havebridges supporting unconnected portions of the stencil mask, and allowfor the application of the complete design with a single stencil in asingle session. The method of manufacturing the stencil is efficient andrespects the environment by producing minimal waste during theproduction process. The stencil is strong, flexible, and easilycleanable with a minimum use of detergents and other materials. In oneembodiment, the stencil is formed by providing a first layer of transfermaterial printed in the configuration of the stencil mask on apolyester, paper, or reusable glass fiber release coated carrier, thetransfer material being configured in a design that is a duplicate of anoriginal work of art. The substantially impermeable film formingtransfer material can be formulated from different ink systems such asvinyl inks, acrylic inks, polyurethane inks, polyester inks, and thelike. A method of immolating the textile support substrate with theprinted image includes a transfer method comprising a reusable flexiblecarrier printed with a drying or cross-linking ink surface whereby theprinted design is not transferable to the textile substrate or receptormaterial by the application of heat or printing to the printed materialalone. Instead, A polymer adhesion layer is applied over thetransferable printed design so that the application of heat and highpressure to the transfer sheet causes the polymer layer to melt andmerge and form the composite material. The temporary carrier sheet canthen be removed leaving the ink design transferred in the configurationof the stencil mask and adhered with the polymer adhesion layer, whichis fused with and permanently bonded to the textile stencil supportlayer. A disposable or temporary paper sheet may be used as the transfercarrier, or a reusable carrier may be used, which may be formed frompolyester film, paper, or preferably PTFE coated glass fiber cloth. If atemporary carrier is used, it may be so designed that it can become apart of the product itself and can be used to protect the pressuresensitive adhesive during packing, transport, and after use to maintaintack and insure prolonged reuse. In such a case, there may be no need toapply a silicone protective layer, paper, or film. Reusable carrierswill support the transfers until the heat lamination to the textilesupport layer and can be reused indefinitely. The transfer of thestencil mask is accomplished without pressure sensitive adhesive.Instead, a thermoplastic polymer mixture of dry powders are sprinkled orprinted onto the wet or gelled transfer ink film on the transfercarrier. Upon application of the transfer carrier to a textile supportsheet under heat and pressure, the powders melt and adhere by bondingand fusing to the textile support sheet and the melting powder permeatesthe open woven structure of the textile to form the composite stencilconfiguration. The thermoplastic polymer layer can be mixed withhot-melt particles or separately coated so that a tacky adhesive layerwill form under the textile material after processing and heatlaminating, to insure the adhesion of the stencil to the decorativebackground and keep it in place during decoration and or printing.

The composite stencil can be formed with a permanent release carrierthat remains with and becomes a part of the product after production. Insuch a case, a filmic sheet coated with a modified silicone coating isprinted with pressure sensitive adhesive and stencil mask material, andis printed or sprinkled with a polymer adhesion layer. The textile sheetis then laminated atop the adhesion layer using heat, which fuses thetextile sheet to the stencil mask. The transfer carrier stays with theproduct in this embodiment and can be removed by a user for decoratingwith the stencil and replaced after decorating to allow cleaning and toprotect the PSA layer after use.

Thus, an improved composite stencil, its method of fabrication, and itsuse is now provided that successfully address the problems andshortcomings of the prior art. The stencil has no bridges, can be usedto apply an entire design with a single stencil, and is fabricated witha minimum of waste and with minimum environmental impact. Coloringsuggestions to the user can be provided on the stencil itself, so thatthe stencil and instructions for use become unified. The stencil isdurable, washable, reusable indefinitely, and significantly reduces thecomplexity of applying designs both for the professional and theamateur. These and other aspects, features, and advantages of thestencil technology disclosed herein will become more apparent uponreview of the detailed description set forth below, when taken inconjunction with the accompanying drawing figures, which are brieflydescribed as follows.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 illustrates a composite stencil according to an embodiment of theinvention and having first a film-forming water and solvent resistanttransfer layer, and a second layer of thermal forming powder orformulated as a printable thermal ink layer including optional hot melttack activatable particles.

FIG. 2 illustrates a PTFE coated glass fiber release carrier accordingto the disclosure.

FIG. 3 illustrates woven textile support material, which is pressed andstabilized to form a interwoven stable textile support layer to receivethe transferable ink layer with the thermoplastic polymer layer to forma composite stencil.

FIG. 4 illustrates the application of a pressure sensitive adhesivebacking layer, which may be printed or coated onto the back of thecomposite stencil.

FIG. 5 illustrates how the adhesive pressure sensitive adhesive layer isprotected with a silicone coated paper or foil.

FIG. 6 illustrates a first process for applying a flexible transferstencil mask and a dye sublimation transfer layer along with an adhesivepowder to a temporary transfer paper carrier.

FIG. 7 illustrates an optional process for applying a flexible transferstencil mask and a pressure sensitive adhesive powder to a filmicrelease transfer carrier.

FIG. 8 illustrates yet another optional process for applying a flexibletransfer stencil mask and an adhesive powder to a glass fiber PTFEcoated temporary release transfer carrier.

FIG. 9 illustrates the textile support substrate material before andafter being compressed and stabilized.

FIG. 10 illustrates the process of applying the flexible stencil mask tothe textile support layer and also the pressure sensitive adhesive andrelease layer to the back side of the composite stencil.

FIG. 11 illustrates another alternative method of making a releasecarrier wherein the release carrier becomes a permanent part of thestencil to protect the adhesive layer.

FIG. 12 illustrates use of the permanent release carrier of FIG. 11 inthe formation of a stencil mask according to the invention.

FIG. 13 illustrates the direct printing of the adhesive layer with thelaminated textile support sheet with the printed stencil ready to beimage fused.

FIG. 14 illustrates a fused composite stencil formed by the processillustrated in FIG. 13 with its permanent protective film or paperrelease carrier.

DETAILED DESCRIPTION

Stencils and their fabrication and uses will now be described in moredetail with reference to the accompanying drawing figures. An overviewdescription will be presented first in order to establish basicprinciples of the stencil and its use, followed by a more detaileddescription and examples.

FIG. 1 illustrates a composite stencil 11 according to principles ofthis disclosure. The stencil 11 comprises a porous textile support layer12 made of woven intersecting elements 13 and 14. As detailed below, thesupport layer 12 has been stabilized by applying heat and pressure tofuse the elements together to form a more rigid and less deformablesheet. A flexible stencil mask 16 is applied to the textile supportlayer 12 and defines open areas 18 of the stencil through which paintwill be applied by an ultimate user to reproduce an image. As describedin detail below, the textile support layer within the open areas may bedyed in a sublimation dye process to suggest to a user the colors thatshould be applied in the various areas of the stencil.

The stencil mask 16 is fused and bonded to the textile support layer bya thermal polymer adhesion layer 17, which is fused both to the flexiblestencil mask 16 and fused into the mesh of the textile support layer 12.This not only bonds the stencil mask to the support layer, it also sealsthe textile support layer in regions of the stencil mask outside theopen areas 18. A pressure sensitive adhesive layer 19 is applied to theback of the stencil so that the stencil will adhere to surfaces to whichdesigns are to be applied. Preferably, this layer is made of a materialthat can be adhered and removed over and over so that the stencil can bemoved and reused many times. When not in use, the pressure sensitiveadhesive layer is protected by a protective siliconized paper layer 21(FIG. 5).

It will be appreciated from FIG. 1 that a composite stencil formedaccording to this disclosure is devoid of any bridges that hold floatingor unconnected pieces of the stencil mask in position. Instead, thetextile support layer supports and holds all pieces of the stencil maskin their proper positions. Thus, since the paint used with the stencilis applied through the textile support layer, the resulting image alsois devoid of gaps that are created with traditional stencils. As aresult, the entire image can be applied with a single stencil and in asingle session without the need for complementing overlappingsequentially applied stencils. This is not only quicker and lesscomplicated, it results in a better image with finer details and moresubtle transitions.

FIG. 2 illustrates a polytetrafluoroethylene (PTFE or Teflon®) coatedglass fiber sheet 26 that may be used as a reusable transfer carrier inthe process of fabricating composite stencils according to thisdisclosure. This process is described in detail below; however, theoptional PTFE coated glass fiber sheet 26 comprises a glass fiber matmade of woven elements 27 and 28. Alternatively, the mat may be made ofa non-woven glass fiber material. In any event, the mat is infused witha coating of PTFE material, which lends strength, provides a releasesurface, and results in a transfer sheet that is reusable in the processof fabricating composite stencils of this disclosure.

FIG. 3 illustrates the textile support layer 12 comprising a mesh or matof woven together textile elements 13 and 14. The porosity of thesupport layer may vary, but generally is selected so that the particlesof pigments within the paints to be used with the stencil will passthrough the openings in the woven fabric to be applied to a surfacebelow. In FIG. 3, the textile sheet has been prepared by application ofpressure and heat to fuse the elements 13 and 14 together so that thetextile sheet is stabilized and forms a more rigid and less deformablesupport layer in the finished composite stencil.

FIG. 4 illustrates application of the pressure sensitive adhesive layer19 to the back side of the composite stencil. The adhesive is applied inthe same pattern as the stencil mask 16 on the front side of the stenciland may be applied by being printed or otherwise applied to a transfersheet and pressing the transfer sheet to the back of the stencil withheat. Alternatively, the pressure sensitive adhesive layer 19 may beprinted onto the back of the stencil. In any event, a protective sheet21 (FIG. 5) is applied over the pressure sensitive adhesive to protectthe adhesive and to prevent it from drying out between uses of thestencil. The protective sheet 21 may be made of a siliconized paper orother appropriate material.

FIGS. 6 through 10 illustrate methods and processes of fabricatingcomposite stencils according to this disclosure. The processes will bedescribed generally here, followed by a detailed description withexamples.

FIG. 6 illustrates one process for fabricating a temporary transfersheet used to transfer a stencil mask to a stabilized textile supportlayer in the formation of composite stencils. The process proceeds fromtop to bottom in FIG. 6. A temporary transfer paper carrier is coatedwith a release layer 37, which also may serve as a dye sublimationtransfer layer. Next, dye sublimation inks 38 may be applied in apattern that corresponds generally to the open areas of the stencilmask. These inks will serve to dye the textile support layer in the openareas of the stencil to suggest color variations to a user duringapplication of a design. The flexible polymer stencil mask material 39is then applied in the areas of the stencil that are to be masked.Finally, an adhesion layer is applied to the polymer stencil mask toinsure that the mask becomes fused and bonded to the textile supportlayer when the mask is applied thereto. The adhesion layer may be apolymer powder adhesion material 41 applied by spraying or sprinklingonto the stencil mask, or, alternatively, it may be printed onto thestencil mask as indicated at 42 using various known printing techniques.The adhesion material sticks to the exposed surface of the stencil maskmaterial, which is still tacky or only partially cured. The completedtransfer sheet is illustrated at the bottom of FIG. 6 with all layersapplied as described. The stencil mask and sublimation inks, if used,are now ready to be applied to a stabilized textile support sheet in thefabrication of a composite stencil.

FIG. 7 illustrates an alternate technique for forming a temporarytransfer sheet. Here, the temporary carrier is a filmic sheet 46, ratherthan the paper sheet of FIG. 6, to which a release layer 47, the stencilmask 48, and an adhesion layer is applied. Again, the adhesion layer maybe sprayed or sprinkled onto the stencil mask as illustrated at 49, orit may be printed onto it as illustrated at 51. Because of the nature ofthe filmic sheet, it is not feasible to use dye sublimation inks withthe embodiment of FIG. 7; however, it may be useful as a temporarytransfer carrier where composite stencils are to be made withoutcoloring the open areas of a stencil.

FIG. 8 illustrates yet another alternative technique for forming atransfer sheet for use in making composite stencils. In thisalternative, the transfer carrier can be cleaned and reused after eachuse rather than discarded, making it a more efficient and eco-friendlyalternative. Here, the transfer carrier comprises a PTFE coated glassfiber mat 56 (also 26 in FIG. 2). The glass fiber mat 56, 26 hasinterwoven elements 27 and 28 that are made of a glass fiber material.The mat is coated or impregnated with a PTFE coating 29 to render itmore robust and to provide a reusable release surface to the carrier sothat it may be used again and again. As with the filmic release carrierof FIG. 7, the stencil mask material 57 is applied to the PTFE coatedtransfer carrier 56 by an appropriate printing technique, whereupon apolymer adhesion layer is sprinkled (58) or printed (59) onto thestencil mask material for adhering the stencil mask material to thestabilized textile sheet when making composite stencils according tothis disclosure.

FIG. 9 illustrates the process of stabilizing a textile support sheetprior to application of a stencil mask from one of the transfer sheetsof FIGS. 6 through 8. The textile sheet in its native form is somewhatdimensionally unstable in that it can be stretched, skewed, and warped.This characteristic is unacceptable for a stencil, wherein the mask andopen areas of the stencil must remain fixed with respect to one another.The textile sheet also is not very rigid in its native form, and thistoo is undesirable for a stencil. Accordingly, the textile support sheet61 is treated with heat and pressure to form a stabilized support sheet62. The application of heat and pressure bonds the elements of thesupport sheet together and partially melts and fuses portions of thesheet. This results in a somewhat thinner sheet, but one that is muchmore dimensionally stable and rigid than the original textile, and thussuitable for use as a textile support layer of a composite stencil.

FIG. 10 illustrates a preferred process for fabricating a compositestencil according to the invention. The transfer sheet 55 in thisillustration is the reusable PTFE coated glass fiber sheet of FIG. 8prepared with the stencil mask material 57 and adhesion coating 58. Itwill be understood, however, that this transfer sheet may be replacedwith the temporary filmic transfer sheet of FIG. 7 or the temporarypaper transfer sheet of FIG. 6. In fact, if it is desired to use dyesublimation inks to color open portions of the final composite stencil,the paper transfer sheet of FIG. 6 is the proper choice since such inksare not compatible with the filmic and PTFE coated carriers of FIGS. 7and 8. Regardless of the transfer sheet selected, the transfer sheet 55is applied to the stabilized textile support sheet 62 with heat andpressure. This causes the polymer adhesion layer to melt, fuse with, andseal the textile support sheet and also to form a permanent bond betweenthe textile and the flexible stencil mask material. Furthermore, if apaper transfer sheet with dye sublimation inks is used, it also causesthe dye sublimation inks to permeate and dye the textile support sheetin open areas of the stencil. As a result, the stencil mask ispermanently bonded to the textile support sheet and the sheet is sealedin masked areas of the stencil. The pressure sensitive adhesive layer 66is applied to the back side of the textile support sheet in a patterncorresponding to that of the stencil mask to form the composite stencil67 (also shown in FIG. 4). The temporary transfer sheet is then removedto leave behind a composite stencil 67 (also shown in FIG. 1, where itis identified with the reference numeral 11). The composite stencil isthen ready to be trimmed, whereupon a protective siliconized paper sheet68 (also shown in FIG. 5) is applied to the back of the stencil toprotect and preserve the pressure sensitive adhesive. The compositestencil is now complete and ready for use to apply designs to a widearray of surfaces as described above.

The inventions have been described thus far within the context of atemporary release carrier used to apply the stencil mask and perhapsinks to a textile support sheet. Another and significant approach is toform the stencil with a permanent release carrier that remains with theproduct as a removable and replaceable protective covering for thepressure sensitive adhesive of the stencil. FIGS. 11 and 12 illustrateone embodiment of this approach, and FIGS. 13 and 14 illustrate another.

Referring to FIG. 11, the permanent release carrier 46 in the form of asheet is provided. For this application, the release carrier 46preferable comprises a sheet of polyethylene terephthalate (PET),although other appropriate filmic materials may be used. The PET sheetis coated with a modified silicone release layer 47, which functions asa durable protective material. Next, pressure sensitive adhesive (PSA)50 is printed or otherwise applied atop the release layer 47 in thepattern of the ultimate stencil mask. The stencil mask material 48 isthen printed atop the PSA layer and in the same pattern. Finally, thepolymer adhesion layer 70 for creating a bond between the mask and atextile sheet to be applied. The polymer adhesion layer may be appliedby being printed onto the stencil mask as illustrated at 51 in FIG. 11,or alternatively may be applied as a sprinkled-on powder as indicated at49. If a sprinkled powder is used, the powder sticks to the uncuredstencil mask material 48 forming a layer on the masked areas of thestencil mask.

FIG. 12 illustrates the formation of the final stencil product using thepermanent release carrier per FIG. 11. More specifically, the stabilizedtextile sheet 62 is laminated with, for example, heat and pressure, tothe composite stencil carrier formed in FIG. 11. This causes the stencilmaterial 48 to cure and also causes the polymer adhesion layer to meltand bond with the stabilized textile sheet, thus forming the stencil.The stencil may then be die-cut, as indicated by the blades in FIG. 12.In this embodiment of the stencil, the permanent release carriercomprising the modified silicone coated PET sheet 46 remains a part ofthe product. A user will pull off the PET protective film before usingthe stencil to decorate. After use, the composite stencil is placed backon the PET permanent carrier whereupon the PSA forms a releasable bondto the silicone coated sheet. The stencil can then be cleaned withwater. Cleaning the stencil after placing it back on the release carrierprovides the advantage that paint and water do not tend to seep or runonto the tack side of the composite stencil because it is protected bythe permanent release carrier sheet applied thereto.

FIGS. 13 and 14 illustrate yet another embodiment of a method of forminga composite stencil with a permanent release carrier according to theinvention. Here, the filmic (preferably PET) sheet 46 is coated with amodified silicone coating 47 as in the previous embodiment. Next, thepressure sensitive adhesive 50 is printed onto the coated releasecarrier in the shape of the stencil mask. The stabilized textile sheetis then laminated onto the PSA, which holds the textile sheet in placeon the release carrier. Next, the stencil mask material 48 is printeddirectly atop the stabilized textile sheet in the shape of the stencilmask and polymer adhesive material 70 may optionally be printed orsprinkled atop the stencil mask material, although this is not requiredin this embodiment. The resulting laminate is then fused with heat andpressure to form the finished composite stencil as illustrated in FIG.14. The stencil may then be appropriately trimmed as indicated by theblades in FIG. 14.

It should be noted that in the embodiments of any of FIGS. 11 through14, the permanent filmic release carrier may be replaced with atemporary non-reusable release carrier made of paper or otherappropriate material. This may be desired, when, for example,sublimation dyes are to be used to color open areas of the mask asdiscussed above.

Having described the composite stencil, its fabrication, and its use ingeneral, a more detailed description will now be presented includingspecific examples and preferred formulations for various materials andelements of the stencil.

Referring again to FIG. 1, a strong flexible composite stencil isillustrated and is made out of first a film-forming water and solventresistant transfer layer and a second layer of thermal forming polymerpowder or/and formulated as a printable thermal polymer ink layeroptionally including hot melt-tack particles laminated thereto. FIG. 3shows a woven textile carrier receptor which is pressed, stabilized, andinterlocked to form a interwoven stable fabric support to receive atransferable ink layer with the thermal forming polymer layer presetthrough the woven textile carrier to form a composite. In FIG. 4, anadhesive rear layer or backing is applied to adhere the stencil to asurface during decorating and is protected with a silicone coated paperor foil (FIG. 5). The film forming stencil mask layer may bescreen-printed on to a release coated durable transfer sheet, which maybe a film, paper support, or preferably a glass-fiber cloth PTFE coatedtemporary carrier. Although other printing techniques are possible,screen-printing is convenient because of the relatively thick film thatmust be applied.

After reproducing the printed design, the drying ink needs to be coatedwith a thermal forming polymer layer by means of sprinkling thermallyreactive polymer powder particles onto the wet ink. Alternatively, thethermal forming polymer may be screen-printed n the form of a gelledink, which can be formulated out of vinyl, polyester, polyurethane oracrylic binders. The ink preferably is between 100% solid and not lessthan 45% solids, to ensure the maximum thickness of the plastisol ororganosol ink layer and the thermal polymer reactive adhesion layer.These layers should be fully cured or cross linked to insure maximumfilm-forming properties before heat lamination to the textile supportlayer. The thermal polymer adhesive layer can be formulated withhot-melt particles to obtain a certain amount of tack on the backside ofthe stencil textile after high pressure laminating.

The stencil textile support sheet or receptor (FIG. 3) needs to bestabilized and pressed at approximately its melting point to interlockits filaments and thereby create rigidity and structural integrity priorto receiving the plastisol or organosol printed transfer stencil maskinglayer. The stencil support sheet can be made out of woven textileconsisting of nylon, polyester, polypropylene, or other material thatcan be thermally stabilized.

Another technique is to coat or print the textile support sheet with thethermoplastic polymer prior to direct printing of the thermal reactivefilm forming ink to the textile support layer. The polymer-fusing isapplied directly and stabilizes the stencil to create a less costlycomposite stencil and is perfectly suitable for smaller stencils withthe drawback of interference from the woven material during printing.After printing, the temperature fusion and cross-linking is carried outon the printed fabric.

If a color instruction image is desired on the composite stencil,polyester woven textile is preferred as the support layer and in thiscase the thermal fusing layer of the printed plastisol/organosol stenciltransfer mask also consists of polyester thermoplastic polymer granulateto be coated or printed. In case of dye sublimation image instructions,the image is printed by means of offset printing onto a release carrierprior to screen printing the film-forming stencil mask onto the transfercarrier. The selected mask ink film-former and the stabilizing of thecomposite textile stencil receptor preferably is heated to a temperatureabove 215° C. The transfer application of the mask with the sublimableimage instructions is only durable at a transfer temperature range of190° C. to 210° C.

The transfer application of the printed stencil mask to the textilesupport sheet is done at high pressure and a minimum temperature of 180°C. It can be important that the thermal polymer adhesive be fullypressed through the textile filaments to close totally the openstructure of the woven textile material. This is the process that willcreate the composite. After cooling down the polyester film, paper orglass fiber coated release carrier is pulled away, and if notincorporated, a pressure sensitive adhesive layer (FIG. 4) can beapplied.

As shown in FIGS. 4 and 5, the pressure sensitive layer will keep thecomposite stencil in place on a surface during use for decoration and orprinting, and should be protected by a coated release paper before andafter use. The options for achieving the adhesive layer includeintegration of hot-melt granulate into the heat fusion transfer masklayer. A more controllable tack layer may be produced by printing apressure sensitive adhesive using, for instance, a screen-printingtechnique. The selected adhesive needs to be water and solvent resistantand preferably activatable after cleaning with water when contaminatedwith dust, textile lint, or paper fiber from the decorated background.Less controllable coating techniques for the pressure sensitive adhesivemay include curtain coating or spraying of an adhesive on to thebackside of the composite stencil. These techniques may be suitable forcertain purposes.

Examples of Reusable Transfer Carriers

There are numerous options for the reusable transfer carrier for theprinted mask (see generally FIGS. 1-4). A first example is extrudedfilms of polyethylene terephthalate (PET), or polybutylene terephthalate(PBT). For example, a bi-axially oriented film in a range of 50 to 100micron thickness of PET, such as Mylar®, is coated with a mixture ofpolyvinyl alcohol (“PVA”) and a chrome-fatty acid complex known as“Quilon®.” To insure the adherence of the release coating, the PET filmmay be corona treated. A second example is the use of paper such asvegetable parchment varying from 40 to 80 grams per square meter andbeing sufficient for multiple use. The release coating is applied tothis non-porous paper substrate and cured at approximately 130° C.

When a PET film is used as a permanent rather than a temporary transfercarrier, a modified silicone may be used as a release coating to insurethat the PET film can be removed from the pressure sensitive adhesiveand replaced. Another possibility is to coat the PET with a modifiedcurable polysiloxane formula from General Electric. A compositionparticularly well suited for release coating applications ispolysiloxane formulations containing effective amounts of.alpha.-olefins as modifiers. This option reduces the catalyst load ofthe compositions without affecting their performance as release coatingcompositions. Preferred diorganopolysiloxane base polymers arevinyl-chainstopped diorganopolysiloxanes. The curing reaction that takesplace between the vinyl-functional polysiloxane base polymer and the SiHcontaining cross-linking agent is an additional cure reaction, alsoknown as a hydrosilation. The compositions may be thermally curedbetween about 95° C. and 130° C. by means of a platinum catalysed crosslinking reaction between the vinyl groups of the base polymer and theSiH reaction sites of the cross-linking.

The fourth example is of a reusable transfer carrier made fromglass-fiber woven materials. Teflon (PTFE) is coated onto sheets of suchmaterial, or a continuing belt of the material may be coated dependingon the preferred production method. The amorphous fluoropolymer coatedmaterial may be one of the most suitable coatings for this invention.The glass fibers create a durable and reusable transfer carrier.Suitable laminates of this type are offered by Norton Company, WayneN.J. An alternative option option is to utilize a Teflon-coated Kaptonpolyamide in sheets or belts.

Example of a Dye Sublimation Dual Purpose Transfer Carrier

The dual sublimation dye transfer carrier may comprise any suitablesheet material, that is relatively non-porous and substantiallyimpervious to the release layer and the dye bonding compositioningredients. For example, the dual sublimation dye transfer paper maycomprise polyester film or paper. Other materials that may be used willoccur to those skilled in the art.

In one method for dye transfer printing of a sublimable dye onto thestencil fabric with the film-formed transfer mask, heat and pressure areapplied to the dye transfer carrier, which will readily accept thesublimation dye from the offset printed ink. This improvement comprisesapplying a composition (A) with a polyester resin having free carboxylgroups, a hardener and a dye binder which is a polymer of one or moremonomers selected from the group consisting of unsaturated aliphatichydrocarbons, acrylic acid esters, methacrylic acid esters, vinylpropionate, vinyl isobutyl ether, vinyl acetate, styrene andacrylonitrile. The transfer from the sublimation dye transfer carrier tothe stencil fabric caises the polyester resin to bond the dye securelyto the composite fabric stencil such that the dye will withstandnumerous cleanings. The dual release coating is formed by using (B) PVA,Quilon, Polyethylene emulsions with the film-formed stencil mask image,the dye sublimation layer may be interposed between layers, causing therelease agent layer or a part of it with the dye and the film-formedtransfer mask to transfer onto the polyester composite stencil fabric.

Any sublimable dye known to those skilled in the art to bond effectivelyand satisfactorily to polyester may be used in practicing the invention.Preferred are disperse dyes, listed in the Color Index under the heading“Disperse Dyes.” These dyes may include, for example, azo,anthraquinone, quinophthalone, nitro, azomethine, and styryl-type dyes.

Examples of Film-Forming Plastisol Stencil Masks

A non-volatile, fast-set, heat-radiation-dry plastisol or organosolvehicle for printing inks is preferred for the stencil mask material.Such materials generally include finely divided particles, athermoplastic resin that solidifies at room temperature dispersed in asufficient amount of compatible, reactive liquids, and or plasticizersto form a plastisol. After printing to the temporary transfer carrier,the plastisol is heated above the softening temperature of the resinmixture, which then swells, dissolves, and effectively absorbs theliquids such as plasticizers, monomers etc. to react cross-link andcreate the film-former. The resin may be pigmented to provide acontrasting color to present the graphic stencil image of the reproducedart to the stencil user. There are a number of liquids usable to createa printable paste substance.

Whereas it is usually preferable that the compositions covered by thisinvention contain little or no solvent and are, indeed, 100%non-volatile and thus extremely friendly to the environment, it is, ofcourse, possible to reduce viscosity using normal organic solvents orwater in which case it is usual to evaporate the solvents before thecross-linking operation takes place. In certain cases the solvents maystill remain whilst the solubilizing of the polymer takes place wherethe type of remaining solvent can influence the suspension of the powderpolymer. The solvent can also be water in certain cases where thecross-linking monomers and oligimers are for example are waterdispersible.

In addition to a powdered polymer, the printing ink compositions of thisinvention may also include one or more non-reactive polymers that may bepre-dissolved in the liquid composition or in components of the liquidcomposition, such as in the polymerisable monomer(s) or oligimer(s).Suitable non-reactive polymers include acrylic.

Examples of Pigments and Dyes

The compositions can be pigmented or dyed by grinding pigments into theliquid plasticizers, monomers, or polymers, or by dissolving the dyes.

Plastisol or organosols generally refer to dispersions of fine-particleplastic powders in plasticisers and other liquids that harden or curewhen heated to higher temperatures or by other initiation. Plastisolscurrently in use typically are composed of fine-particle polyvinylchloride, polyvinyl chloride-vinyl acetate copolymers, and polyalkylmethacrylate such as polymethyl methacrylate copolymers, these aredispersed in plasticisers and other compatible liquids to form aprintable paste. These pastes can be mixed with multi functionalmonomers, oligomers, and prepolymers capable of polymerization orcopolymerization using the respective initiator systems to influenceprocessing and application characteristics as desired.

There is development of new polyolefin-based plastisols or organosolsand a method for their production. These plastisols or organosols can bechlorine-free, or contain a minimal amount of chlorine, which means thatthey off-gas or split off neither chlorine nor hydrogen chloride and aretherefore are free from the disadvantages encountered in the production,processing, and disposal of polyvinyl chloride containing plastisols.

In general, polyolefin types that are commercially available in granularform are to be used for producing these plastisols or organosols. Theproduction method ensures efficient fine-particle dispersion of thegranular polyolefin in a dispersion medium so that the polyolefin isdissolved homogeneously in the dispersion medium in a very short timeduring the preparation of the plastisol in order to produce printinginks with excellent product properties at relatively high efficiency andwith a low energy demand of the polymerisation process.

Dual Radiation Curing and Cross-Linking

The other component of the plastisols or organosols is a dispersionmedium that consists of liquid monomers or monomers that melt at lowtemperatures. These monomers are capable of polyaddition and/orpolymerizable or copolymerizable and/or oligomers and/or prepolymers.Optionally, liquids and plasticisers in dispersible or mixable portionsmay be used. The dispersion medium preferably is composed so that itdoes not dissolve the polyolefin at room temperature and causes littleor no swelling of the fine-particles, but does dissolve the poly-olefinat temperatures exceeding its melting temperature and produces highlyconcentrated solutions or colloidal solutions of the polyolefin.

An initiator system is used for polymerization of the plastisol ororganosol containing a dispersion medium composed of radicallypolymerizable and copolymerizable monomers and/or prepolymers andoptional liquid plasticisers that consist of radical initiators such ascommon organic peroxides and/or suitable photo initiators. Examples aredi-tert.-butyl peroxide, tert.-butylhydroperoxide, dicumyl peroxide,dilauryl peroxide, benzoyl peroxide, tert.-butyl perbenzoate and manyother compatible combinations of epoxide compounds (monomers and/oroligomers and/or prepolymers) and allyl and/or vinyl and/or(meth)acrylate compounds and/or unsaturated polyester, vinyl ester,polyester acrylate resins and optional liquid softeners. An initiatorsystem made of saturated and unsaturated acid anhydrides andfree-radical initiators such as common organic peroxides and/or suitablephoto initiators may be used for gelating the plastisol or organosol ina combined polyaddition, polymerization and copolymerization process.Photo initiators can be used as an initiator system either alone or incombination with the radical or ionic initiators mentioned above.Commercially available radical and ionic photo initiators are suitable,the plastisols or organosols according to this application can also bepolymerised selectively in multiple layers.

The printed plastisol or organosol is cross-linked at temperaturesranging from 140° C. to 200° C. depending on the composition of theplastisol or organosol and plasticizers to obtain full polymerization.The applied print can be cured at a constant temperature over time or atincreasing temperatures over time. If there are more layers of plastisolor organosol ink the first layers may be just slightly gelled at maximum100° C. to 120° C. for inter-adhesion. This also prevents shrinkage ofthe transfer carriers. The required curing times are between 30 secondsto 3 minutes depending on the mass and heat absorption of the transfercarrier. The printed stencil mask can be heated using hot air, infraredradiation, high frequency radiation or the like.

If a dual cure method is selected, the plastisol is heated prior toultraviolet exposure for homogeneous melting of the polyolefin particleswhen the plastisols of this example are polymerised using photoinitiators. The preheated plastisol can also be polymerised selectively,layer by layer as long as the gelling temperature starts at about 80° C.and does not exceed about 120° C., total cross-linking can only startafter all layers are applied, using subsequent hot air, infrared andultraviolet radiation, electron beam, or ultraviolet laser beamirradiation.

Examples of Pressure Sensitive Adhesives for Composite Stencils

To keep the composite stencil in position during use and to preventpaint from running or seeping underneath the stencil mask contour, apressure-sensitive adhesive is provided that is selectively removablefrom most surfaces and that retains that property for protracted periodsof time, and is thus repositionable on surfaces. This result is achievedby preparing a pressure sensitive adhesive based on solvent solutions,cross-linking ultraviolet solutions, radiation curable or preferably awater based emulsion type, formulated from a number of tackifiers likecopolymers of ethylene, acrylic ester, natural rubber, synthetic rubber,acrylate, and poly(vinyl acetate), poly(ethylene-co-vinyl acetate)copolymers. This tacky pressure-sensitive adhesive is modified withfillers, sphere particles and/or emulsified wax, surfactant or mixturesthereof present in a concentration to reduce adhesivity of the adhesiveto a level sufficiently to allow removability and replacabilety, and toallow the adhesive to be cleaned with water and detergent to achievetack-reactivation when tackiness is degraded by dust, textile lint, orpaper fibers from decorated surfaces or otherwise.

The pressure-sensitive adhesive polymers used in the instant inventionmay be inherently tacky or tack may provided by the inclusion of atackifier or plasticizer added during the formulating stage.Alternatively, the PSA layer may be formed by a controlled migration outof the plastisol or organosol printed layer before cross-linking toactivate the tack of the PSA layer, which is non or low tack beforebeing in contact with the printed mask. The filler, sphere's, and waxand/or surfactant are provided during the preparation stage and cast aspart of a homogenous emulsion to provide a pressure-sensitive adhesivecoating at any desired uniform level of removability, as compared to theunmodified pressure-sensitive adhesive composition. This is inconsequence of a reduction in adhesion level. Cross-linking is onlyrequired to a partial level and the adhesive will remain watersensitive. It is preferred to use either the filler, sphere's and waxalone or the filler, sphere's, and surfactant alone.

Emulsifiable wax can be employed in the amount of about 0.5 to about 8%by weight of the emulsion polymer and wax. A surfactant can be employedin the amount of about 0.5 to about 3.5% by weight of the acrylicemulsion polymer and surfactant. When used in combination the totalamount of wax and surfactant present should be less than about 5% byweight of the emulsion polymer and additive wax and surfactant.

Wax reduces dramatically the adhesion level. Wax emulsions includeemulsified petroleum resins, paraffin waxes, oxidized paraffin waxes,microcrystalline waxes, carnauba waxes, montain waxes, polyethylenewaxes and the like emulsified to form a nonionic wax emulsion.

The pressure sensitive adhesive composition may be applied by spraying,curtain coating, or preferably by screen printing in dissolved ordispersion form, so that after thermal drying the layer results in anadhesive film having a thickness of preferably from 15 to 40 m includedthe sphere's particle size.

Suitable adhesive products such as ethylene, vinyl acetate, acrylateemulsion are marketed, by Air Products Polymers, Burghausen, Germany asdispersions, they prove to be suitable ingredients for pressuresensitive adhesives fore this application. The preferred composition,for the pressure sensitive adhesive composition has the followingformulation: ethylene from 5 to 30, with particular preference from 10to 15% by weight, vinyl from 15 to 50, with particular preference from30 to 35% by acetate weight, acrylic from 30 to 70, with particularpreference from 50 to 60% by ester weight, acrylamide from 0 to 8, withparticular preference 0.5% by weight.

Pattern Printing of Pressure Sensitive Adhesives

U.S. Pat. No. 6,541,561 discloses a technique for applying an adhesivein a pattern shape in which the adhesive is printed and can be varied insize and structure and by selecting the coarse-ness of the mesh screen.These patterns can be uniform over the whole area of the mesh or theycan be restricted to particular areas, which is the case for stencils.It is important that the composite stencil of the present inventionwhilst being firmly held on to a surface to be decorated, issubsequently removable and repositionable. It has been found that byprinting the adhesive with thicker peaks in selected areas, the stencilis adhered more on the peaks and less between the peaks, making thestencil easily removable and repositionable.

It is also possible by subsequent flow time or by heating, to induce thefurther flow of adhesive to entirely eliminate the areas of low coatingweight, and minimize the problem of printing under and over the backsideof the composite stencil uneven surface and obtain a perfectly uniformadhesive layer after printing if desired.

These adhesive pattern surfaces give improved adhesion over unevensurfaces like wood-grain, paint and wall paper, furthermore by selectingthe dot sizes and shape the adhesive surface area can be adjusted toease removability not only by the modified tack level but also by thesurface area.

It is also possible to print the adhesive in patterns indirectly byfirst printing the adhesive on a release surface, for example, aprotective silicone release paper or PET film.

One of the benefits of this method is that there is a strong attachmentof the silicone paper or PET film composite stencil, even if theadhesive is relatively low in tack, and the silicone paper or substrateis not easily detached during packaging if the silicone paper is notsecurely bonded, and comes away in the insertion process.

Where the pattern printing is uniform, no registration may be required,but it would be possible to align sheets to include the possibility ofregistering non-uniform adhesive patterns requiring some degree ofregistration of the adhesive to the composite stencil, it is found thatif the dot size or pattern shape is finer than the textile filament allover coating an laminating is not obstructing the open parts of thecomposite stencil.

The innovative way of using the pattern pressure sensitive adhesive isselecting the pattern shape and size that during the application to thedecorating surfaces no air-entrapment occurs and by selecting the dotsize the adhesive still can have a sufficient tack level but repositionand removability is optimal for the user/decorator. It is found for thisuse that a 30 to 45% dot size and the equivalent of 80 to 120 lines perinch is offering the best PSA structure.

After or before the application of the pressure sensitive adhesive thecomposite stencil is protected, printed, coated or laminated with acommercial release coated paper selected from a paper weight andstrength to allow prolonged use, preferable when coated or printed priorto laminating with a double side (PE) extruded one side silicone coatedpaper.

Laminating the Printed Film-Forming Stencil Masks

A method is described of heat and pressure transfer laminating onto thereceptor textile cloth substrate. As discussed, the cloth will have beenpressed under heat to stabilize the fibers, which become interlocked forrigidity and stability. The polyester is pre-shrunk prior the actualtransfer process. The printed transfer mask is formed on a carrier,paper, film or glass fiber Teflon coated sheet or belt as describedabove. The polymeric adhesive and, optionally, the sublimable dye image,is fused with the textile substrate by heat and pressure to create thecomposite stencil, wherein the polymeric adhesive and barrier covers thetransfer mask. A method of immolating the stencil textile compositereceptor relates to a transfer method comprising a reusable flexiblecarrier printed with a complex of drying inks. A heat transfer press,comprising a support, a lower plate support, an upper plate on saidsupport heated thermostatic temperature controlled, an air conduitattached to air lift cylinders to act and react said cylinders inunison, the upper plate having moving means associated with said supportcomprising an upper plate body provided with a Teflon coating, thisheated plate having a number of chambers, and a plurality of radiantheating elements fastened respectively, timing means, pressure andtemperature for actuating the upper plate, the transfer carrier with thetransfer mask and the pre established textile stencil receptor areplaced on the lower plate to a second position wherein the lower andupper plates are controllable pressed to the temporary transfer carriersupporting the instructive image with the transfer mask and thepolymeric adhesive, heat is transferred to the polyester cloth, and willbe softened to receive the vaporized sublimable dye and/or the transfermask to form the composite stencil permanently after the desiredpressure, temperature and time, the upper plate being moved upwardly bythe air lift cylinders, after cooling, the temporary carrier can peeledaway and be reused.

Color yield and definition of the coloration processes for the textilestencil support, more especially of sublimable dyes applied by transferprinting, requires higher transfer pressure and temperature and it ispreferred to separately transfer the printed sublimable dye on to thecomposite stencil the improvement is considerable and resistance tocleaning is improved.

Pressure Sensitive Adhesive Formulations

Formula 1—Low-Tack:

Parts by Weight water 100.0 ammonium/sodium 10.0 polyacrylate thickener15-18% solids silica/fumed silica 3.0 glycerol monostearat dispersion40.0 ammonia solution 0.2 polyvinyl methyl ether 5.0 dispersion 55%solids 2-ethyl hexylarylate/vinyl acetate 15.0 dispersion 55% solidscontaining 30 50% 2-ethyl hexylacrylate 2-ethyl hexyl arylate/vinyl 35.0acetate dispersion 55% solids containing 75% 2-ethyl hexylacrylate

The adhesive composition may be widely varied in respect of high and lowtack adhesive levels, drying is to be carried out by air-knives andtemperature to fully evaporate water. If printing is the selectedmethod, mesh count from 165 to 280 per inch are to be considered, themesh is selected according to the required coating weight, dot size, andthe pattern surface.

The rheological approach is to design a gel to help printing the dotsand patterns the aqueous medium as a dispersion medium for theabove-described composite particles is usually water, but in some casesit is also possible to use a mixed solvent of water with a watermiscible organic solvent.

Formula 2—Medium-Tack:

Parts by Weight terpene resin ( melting point 80-1200 C. ) 37.3 preparedin the form of a 50% emulsion polyvinyl butyl ether in the form of a37.3 60% emulsion silica/fumed silica 2.0 copolymer of butyl acrylateand 11.5 methyl acrylic in the form of a 50% emulsion methyl cellulosein 10% water solution 12.5 water soluble flow agent 0.8

The adhesive composition may be widely varied in respect of high and lowtack adhesive levels.

Formula 3—High-Tack:

Parts by Weight water 20.0 ethylene, vinyl acetate, acrylate 37.3 in theform of a 50% emulsion aerogel silica 10-12 millimicron 2.0 aliphatichydrocarbon solvent 4.5 polyethylene wax emulsion in water 10.5

The wax content of this adhesive formulation may be widely varied inrespect of repositionability.

Plastisol/organosol Film Forming Formulations

Formula 1—Plastisol Transfer Ink:

Parts by Weight vinyl chloride homopolymer 65.0 epoxy plasticizer 30.0tin based stabilizer 2.0 alifatic hydro carbon 2.5

Pigment and or dye can be added to color the mask, depending on the oilabsorbing of the pigment the above formulation needs to be modified forplasticizer levels.

Formula 2—UV Plastisol Dual Cure:

Parts by Weight vinyl chloride acetate copolymer 25.0 polyester acrylateoligomer 35.0 tripropylene glycol diacrylate 15.0 epoxy plasticizer 10.0bezophenone photoinitiator 4.0 benzildimethyketal photoinitiator 1.0

Pigment and or dye can be added to color the mask, depending on the oilabsorbing of the pigment the above formulation needs to be modified forplasticizer levels.

The invention has been described herein in terms of preferredembodiments and methodologies considered to represent the best modes ofcarrying out the invention. It will be clear to skilled artisans,however, that a wide variety of additions, deletions, and modificationsmight well be made to the illustrative embodiments without departingfrom the spirit and scope of the invention as set forth in the claims.

1. A composite stencil comprising: a support layer configured to allowpaint to pass therethrough and having a front side and a back side; astencil mask on the front side or the back side of the support layer anddefining masked areas of the composite stencil and open areas throughwhich paints are to be applied; a pressure sensitive adhesive applied tothe back side of the support layer in the pattern of the stencil maskfor removably adhering the stencil to a surface; and a protective sheetcovering the pressure sensitive adhesive layer and being removable toexpose the pressure sensitive adhesive for adhering the stencil to asurface and re-applyable for protecting the pressure sensitive adhesivewhen the stencil is not in use.
 2. A composite stencil as claimed inclaim 1 wherein the support layer comprises a woven material.
 3. Acomposite stencil as claimed in claim 2 wherein the support layercomprises a textile.
 4. A composite stencil as claimed in claim 3wherein the textile is woven to define openings sized to allow pigmentsto pass through the support layer in the open areas of the stencil.
 5. Acomposite stencil as claimed in claim 1 wherein the support layer isstabilized to enhance stability and rigidity.
 6. A composite stencil asclaimed in claim 5 wherein the stabilized support layer is a heat andpressure stabilized support layer.
 7. A composite stencil as claimed inclaim 1 wherein the stencil mask comprises a flexible polymer.
 8. Acomposite stencil as claimed in claim 7 wherein the flexible polymercomprises a plastisol or an organosol.
 9. A composite stencil as claimedin claim 8 wherein the plastisol or organosol is a printable ink priorto application.
 10. A composite stencil as claimed in claim 1 whereinthe protective sheet comprises a siliconized paper.
 11. A compositestencil as claimed in claim 1 further comprising an adhesion layerbetween the stencil mask and the support layer bonding the stencil maskand support layer together.
 12. A composite stencil as claimed in claim3, further comprising an adhesion layer between the stencil mask and thesupport layer bonding the stencil mask and support layer together,wherein the adhesion layer comprises a thermal polymer, termed thermalpolymer, fused both to the stencil mask and into the mesh of saidtextile.
 13. A composite stencil as claimed in claim 12 wherein thethermal polymer is applied in the same pattern as the stencil mask. 14.A composite stencil as claimed in claim 1 wherein the support layer isdyed within at least one open area.
 15. A composite stencil as claimedin claim 14 wherein the at least one open area is dyed with asublimation dye.
 16. A composite stencil as claimed in claim 14 whereinat least two open areas are dyed.
 17. A composite stencil as claimed inclaim 16 and wherein the colors of the dyed open areas suggests colorsto be applied through the open areas during use of the stencil.
 18. Acomposite stencil as claimed in claim 1 wherein the support layercomprises a non-woven material.
 19. A composite stencil as claimed inclaim 18 wherein the non-woven material comprises a glass fibermaterial.
 20. A composite stencil as claimed in claim 1 wherein theprotective sheet comprises a silicon coated film.
 21. A compositestencil as claimed in claim 20 wherein the film is selected from thegroup consisting essentially of PET, PE, and HDPE.